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  2013. 5. 09 1/7 semiconductor technical data kf7n80p/f n channel mos field effect transistor revision no : 2 general description this planar stripe mosfet has better characteristics, such as fast switching time, low on resistance, low gate charge and excellent avalanche characteristics. it is mainly suitable for active power factor correction and switching mode power supplies. features h v dss =800v, i d =7a h drain-source on resistance : r ds(on) (max)=1.45 ? @v gs =10v h qg(typ.)= 45nc maximum rating (tc=25 ? ) * : drain current limited by maximum junction temperature. characteristic symbol rating unit kf7n80p kf7n80f drain-source voltage v dss 800 v gate-source voltage v gss ? 30 v drain current @t c =25 ? i d 7 7* a @t c =100 ? 4.4 4.4* pulsed (note1) i dp 20 20* single pulsed avalanche energy (note 2) e as 360 mj repetitive avalanche energy (note 1) e ar 11 mj peak diode recovery dv/dt (note 3) dv/dt 4.5 v/ns drain power dissipation tc=25 ? p d 160 44.6 w derate above 25 ? 1.28 0.36 w/ ? maximum junction temperature t j 150 ? storage temperature range t stg -55 q 150 ? thermal characteristics thermal resistance, junction-to-case r thjc 0.78 2.8 ? /w thermal resistance, junction-to-ambient r thja 62.5 62.5 ? /w g d s pin connection dim millimeters to-220ab 1.46 a b c d e f g h j k m n o 0.8 0.1 + _ 2.8 0.1 + _ 2.54 0.2 + _ 1.27 0.1 + _ 1.4 0.1 + _ 13.08 0.3 + _ 3.6 0.2 + _ + _ 9.9 0.2 + _ 9.2 0.2 + _ 4.5 0.2 + _ 2.4 0.2 15.95 max 1.3+0.1/-0.05 0.5+0.1/-0.05 3.7 1.5 a f b j g k m l l e i i o c h nn q d q p p 1. gate 2. drain 3. source 12 3 1. gate 2. drain 3. source to-220is (1) a a b b c c d d e e f f g g h h 1.47 max 1.47 max j j k k l m l n nn o o q r q r 123 m dim millimeters *single gauge lead frame 10.16 0.2 + _ 15.87 0.2 + _ 2.54 0.2 + _ 0.8 0.1 + _ 3.18 0.1 + _ 0.5 0.1 + _ 3.23 0.1 + _ 13.0 0.5 + _ 2.54 0.2 + _ 4.7 0.2 + _ 6.68 0.2 + _ 2.76 0.2 + _ 3.3 0.1 + _ 12.57 0.2 + _ kf7n80p kf7n80f
2013. 5. 09 2/7 kf7n80p/f revision no : 2 electrical characteristics (tc=25 ? ) characteristic symbol test condition min. typ. max. unit static drain-source breakdown voltage bv dss i d =250  a, v gs =0v 800 - - v breakdown voltage temperature coefficient  bv dss /  t j i d =250  a, referenced to 25 ? - 0.65 - v/ ? drain cut-off current i dss v ds =800v, v gs =0v - - 10  a gate threshold voltage v th v ds =v gs , i d =250  a 2.5 - 4.5 v gate leakage current i gss v gs = ? 30v, v ds =0v - - ? 100 na drain-source on resistance r ds(on) v gs =10v, i d =3.5a - 1.2 1.45 ? dynamic total gate charge q g v ds =480v, i d =7a v gs =10v (note4,5) - 45 - nc gate-source charge q gs - 8 - gate-drain charge q gd - 20 - turn-on delay time t d(on) v dd =300v i d =7a r g =25 ? (note4,5) - 50 - ns turn-on rise time t r - 50 - turn-off delay time t d(off) - 120 - turn-off fall time t f - 50 - input capacitance c iss v ds =25v, v gs =0v, f=1.0mhz - 1450 - pf output capacitance c oss - 150 - reverse transfer capacitance c rss - 20 - source-drain diode ratings continuous source current i s v gs 2013. 5. 09 3/7 kf7n80p/f revision no : 2 normalized breakdown voltage bv dss gate - source voltage v gs (v) fig1. i d - v ds drain - source voltage v ds (v) drain current i d (a) 10 0 10 -1 10 1 68 410 2 fig2. i d - v gs fig3. bv dss - t j fig4. r ds(on) - i d -100 -50 0.8 0.9 1.2 1.1 1.0 050 100 150 drain current i d (a) drain current i d (a) on - resistance r ds(on) ( ? ) fig5. i s - v sd 0.4 0.8 1.0 1.2 0.6 1.4 reverse drain current i s (a) 3.0 2.0 1.5 1.0 0.5 0 2.5 04 212 6810 junction temperature tj ( ) c source - drain voltage v sd (v) 10 0 10 -1 10 1 10 2 fig6. r ds(on) - t j junction temperature t j ( ) 0 50 -100 -50 100 150 normalized on resistance 0.0 0.5 3.0 2.5 1.0 1.5 2.0 c v gs =10v i ds = 7 a v gs = 0v i ds = 250 100 c 25 c 100 c 25 c 1100 0.1 10 0.1 1 10 100 v gs =10v v gs =6v v gs =10v v gs =6v v ds =30v v gs =5v
2013. 5. 09 4/7 kf7n80p/f revision no : 2 drain current i d (a) gate - charge q g (nc) drain - source voltage v ds (v) 0 12 10 6 2 4 8 35 45 40 15 525 20 30 10 0 fig8. q g - v gs fig9. safe operation area gate - source voltage v gs (v) 10 1 10 2 10 1 10 2 10 3 10 4 10 1 10 -1 10 0 10 0 10 -2 10 2 10 3 fig10. safe operation area 0 1 6 2 4 8 5 3 7 50 150 125 100 25 75 0 drain current i d (a) (kf7n80p) i d =7a c junction temperature t j ( ) fig11. i d - t j operation in this area is limited by r ds(on) v ds = 480v t c = 25 t j = 150 single pulse c c dc 10 s 1ms 100 s 10ms fig 7. c - v ds drain - source voltage v ds (v) capacitance (pf) 0 10203040 c rss c oss c iss drain current i d (a) drain - source voltage v ds (v) 10 1 10 2 10 1 10 -1 10 0 10 0 10 -2 10 2 10 3 (kf7n80f) dc 10 s 1ms 100 s 10ms operation in this area is limited by r ds(on)
2013. 5. 09 5/7 kf7n80p/f revision no : 2 time ( sec ) fig13. transient thermal response curve transient thermal resistance 10 -5 10 -3 10 -2 10 -1 10 0 10 1 10 -4 (kf7n80f) time (sec) fig12. transient thermal response curve transient thermal resistance 10 -5 10 -3 10 -2 10 -1 10 0 10 1 10 -4 10 -2 10 -1 10 0 duty=0.5 single p ul se 0.05 0. 02 0.2 0. 01 0.1 t 1 t 2 p dm - duty factor, d= t 1 /t 2 - r th(j-c) =0.78 c/w max. (kf7n80p) 10 -2 10 -1 10 0 10 1 t 1 t 2 p dm - duty factor, d= t 1 /t 2 - r th(j-c) = 2.8 c/w max. single pulse dut y=0 .5 0.05 0.02 0.2 0.01 0.1
2013. 5. 09 6/7 kf7n80p/f revision no : 2 fig14. gate charge i d i d v ds v gs v gs v ds v gs 1.0 ma fast recovery diode 10v 10 v 25 ? r l q g q gd q gs q t p fig16. resistive load switching fig15. single pulsed avalanche energy v ds (t) i d (t) v ds v gs 10 v 25 ? l time e as = li as 2 bv dss - v dd bv dss 1 2 v dd i as bv dss v ds v gs t r t d(off) t off t d(on) t on t f 10% 90% 50v 0.8 v dss 0.5 v dss
2013. 5. 09 7/7 kf7n80p/f revision no : 2 fig17. source - drain diode reverse recovery and dv /dt i f i s v ds v sd i sd (dut) v ds (dut) v gs 10v driver dut body diode recovery dv/dt body diode forword voltage drop body diode forword current body diode reverse current di/dt v dd i rm 0.5 v dss


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